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Electronic Packaging Material - Potting and Encapsulating Materials


Details: EPM-2422 - CTE (above Tg) 490 ppm/°C 1.43 Refractive Index


Product Profile: EPM-2422 Product Profile - Polymer Systems Technology Limited.pdf
Basic Product Overview:
Section: Electronic Packaging Material
Description: Potting and Encapsulating Materials
NuSil ID: EPM-2422
Flow/Viscosity: A:3,500
Cure System: Platinum Addition
Solids Content: - -
Work Time: 7,000 cPs max after 2 h
Cure Time/Temp: 4 h / 65
Post Cure Time/Temp: - -
Specific Gravity: 1.04
Durometer Type A Certified: - -
Durometer Type A Typical: 40
Tensile psi Certified: - -
Tensile psi Typical: 650
Tensile MPa Certified: - -
Tensile MPa Typical: 4.5
Elongation Percent Certified: - -
Elongation Percent Typical: 100
Tear PPI Certified: - -
Tear PPI Typical: - -
Tear kN/m Certified: - -
Tear kN/m Typical: - -
Ionic Content* CI - K / Na ppm <5 / <1 / <1
Lap Shear psi/Mpa: 200
Dielectric Strength V/mil: - -
Operating Temp: -115 to 260
Plasticity/Viscosity/Extrusion Typical: - -
Stress Strain: - -
Mix Ratio: 1:1
Colour: Trans
Comments: CTE (above Tg) 490 ppm/°C 1.43 Refractive Index

 

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Back Please note:
Alternative sizes and packaging can and may be supplied, subject to availability of stock.
Products pictured may vary and illustrations are for guidance only!

 



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