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Electronic Packaging Material - Potting and Encapsulating Materials


Details: EPM1-2493 - Thermally conductive, low viscosity silicone elastomer cures with the addition of heat


Product Profile: EPM1-2493.pdf
MSDS PDF A: EPM1-2493_EU_English.pdf
Basic Product Overview:
Section: Electronic Packaging Material
Description: Potting and Encapsulating Materials
NuSil ID: EPM1-2493
Cure Time/Temp: 15 M / 150
Specific Gravity: 2.34
Durometer Type A Typical: 65
Tensile psi Typical: 180
Tensile MPa Typical: 1.2
Elongation Percent Typical: 50
Lap Shear psi/Mpa: 120/0.8
Operating Temp: -50 to 250
Mix Ratio: 1:1
Colour: White
Comments: Thermally conductive, low viscosity silicone elastomer cures with the addition of heat

 

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Back Please note:
Alternative sizes and packaging can and may be supplied, subject to availability of stock.
Products pictured may vary and illustrations are for guidance only!

 



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