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For full Warranty details please refer to the product profile!
Electronic Packaging Material - Potting and Encapsulating Materials
Details: EPM-2422 - CTE (above Tg) 490 ppm/°C 1.43 Refractive Index
| Product Profile: | EPM-2422 Product Profile - Polymer Systems Technology Limited.pdf |
|---|---|
Basic Product Overview: |
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| Section: | Electronic Packaging Material |
| Description: | Potting and Encapsulating Materials |
| NuSil ID: | EPM-2422 |
| Flow/Viscosity: | A:3,500 |
| Cure System: | Platinum Addition |
| Solids Content: | - - |
| Work Time: | 7,000 cPs max after 2 h |
| Cure Time/Temp: | 4 h / 65 |
| Post Cure Time/Temp: | - - |
| Specific Gravity: | 1.04 |
| Durometer Type A Certified: | - - |
| Durometer Type A Typical: | 40 |
| Tensile psi Certified: | - - |
| Tensile psi Typical: | 650 |
| Tensile MPa Certified: | - - |
| Tensile MPa Typical: | 4.5 |
| Elongation Percent Certified: | - - |
| Elongation Percent Typical: | 100 |
| Tear PPI Certified: | - - |
| Tear PPI Typical: | - - |
| Tear kN/m Certified: | - - |
| Tear kN/m Typical: | - - |
| Ionic Content* CI - K / Na ppm | <5 / <1 / <1 |
| Lap Shear psi/Mpa: | 200 |
| Dielectric Strength V/mil: | - - |
| Operating Temp: | -115 to 260 |
| Plasticity/Viscosity/Extrusion Typical: | - - |
| Stress Strain: | - - |
| Mix Ratio: | 1:1 |
| Colour: | Trans |
| Comments: | CTE (above Tg) 490 ppm/°C 1.43 Refractive Index |
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Back | Please note: Alternative sizes and packaging can and may be supplied, subject to availability of stock. Products pictured may vary and illustrations are for guidance only! |
