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For full Warranty details please refer to the product profile!


50ml cart 1-1 kit


400ml cart 1-1 kit


2 pint kit 1 - 1 plastic


2 gallon kit 1 - 1 plastic bucket


10 gallon kit 1 - 1 plastic






 

 

 

Engineering Materials - General Purpose - Potting and Encapsulating Materials for Electronics


Details: R-2188 - Pourable and self-leveling Cures at lower temperatures (≥70°C)


Product Profile: R-2188.pdf
MSDS PDF A: SDS R-2188.pdf
Basic Product Overview:
Section: Engineering Materials - General Purpose
Description: Potting and Encapsulating Materials for Electronics
NuSil ID: R-2188
Flow/Viscosity: A:13k / B:9k
Cure System: Platinum
Work Time: 8 HR +
Cure Time/Temp: 30 M / 150°C
Specific Gravity: 1.05
Durometer Type A Typical: 20
Tensile psi Typical: 475
Tensile MPa Typical: 3.3
Elongation Percent Typical: 350
Mix Ratio: 1:1
Colour: Trans
Comments: Pourable and self-leveling Cures at lower temperatures (≥70°C)

 

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Products pictured may vary and illustrations are for guidance only!

 



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